The following changes in requirements are being proposed:
1. Clarification of Section 1.1 (Scope)
2. Addition of Section 1.2A (Supplementary Test Procedures)
3. Addition of Section 1.2B (References)
4. Clarification of Requirements in Paragraphs 1.3.1 and 1.3.2 for the Section General
5. Revision of the Definition of Various Terms in Section 1.4 (Glossary); Addition of New Terms to the Glossary
6. Addition of Definitions of the Acronyms MAD and RTI
7. Clarification and Reorganization of Section 2.1 (Materials - General)
8. Clarification of Section 2.2 (Base Materials)
9. Clarification and Reorganization of Section 2.3 (Conductor and Conductor Adhesives)
10. Clarification and Reorganization of Section 2.4 (Bonding Film)
11. Clarification and Reorganization of Section 2.5 (Cover Material)
12. Clarification and Reorganization of Section 2.6 (Solder Resist)
13. Addition of Section 2.6A (Plugged-Hole Materials)
14. Clarification and Reorganization of Section 2.7 (HDI Materials)
15. Clarification and Reorganization of Section 2.8 (Stiffener and Adhesive Materials)
16. Clarification and Reorganization of Section 3 (FMIC Constructions)
17. Clarification and Reorganization of Section 4 (Processes)
18. Clarification and Reorganization of Sections 5.1.1 and 5.1.1A (Tests and Applicable Documents)
19. Clarification and Reorganization of Sections 5.1.2, 5.1.2.6, 5.1.2.7, and 5.1.2A (Samples, Singlelayer, Multilayer, and Apparatus)
20. Clarification and Reorganization of Section 5.1.3 (Procedure)
21. Clarification and Reorganization of Section 5.1.4 (Data Collection)
22. Addition of Section 5.1A (Microsection Analysis)
23. Clarification of Section 5.2 (Thermal Shock Test)
24. Clarification and Reorganization of Section 5.3 (Delamination Test)
25. Clarification and Reorganization of Section 5.4 (Plating Adhesion Test)
26. Clarification and Reorganization of Section 5.5 (Bond Strength Test)
27. Clarification and Reorganization of Section 5.6 (Conductive Paste Adhesive Test)
28. Clarification and Reorganization of Section 5.7 (Cover Layer Test)
29. Clarification and Reorganization of Section 5.8 (Ambient Bend Test)
30. Clarification and Reorganization of Section 5.9 (Cold-Bend Test)
31. Clarification and Reorganization of Section 5.10 (Repeated Flexing Test)
32. Clarification and Reorganization of Section 5.11 (Stiffener Bond Strength Test)
33. Clarification and Reorganization of Section 5.12 (Silver Migration Test)
34. Clarification and Reorganization of Section 5.12A (Dissimilar Dielectric Materials Thermal Cycling Test)
35. Clarification and Reorganization of Section 5.13 (Flammability Tests)
36. Clarification and Reorganization of Section 6 (Parameter Profile Indices)
37. Clarification and Reorganization of Section 7 (Markings)